With HELiOS 2020 SP2 we have released the second and last Service Pack for HELiOS 2020. A focus of the further development was the expansion of the new Mask Editor introduced with HELiOS 2020, which has been extended with numerous new functions in SP2.
Examples include the transfer of formats to other mask elements, the exchange of attributes and the list of recently opened files. The development also focused on the further expansion of CAD, CAE and Office interfaces. Particularly worth mentioning here are the batch import/batch update and the placement of marked documents (SOLIDWORKS interface), the transfer of user-defined semi-finished products as sub-items in the product structure (Inventor interface) and the insertion of mail attachments via HELiOS (Office). The HELiOS Spooler has also been improved. For example the model area can now be included when printing and the plot area can be selected when printing AutoCAD files. In addition jobs can now also be bundled by document numbers.
Click here for all the highlights of HELiOS 2020 Service Pack 2